mardi 24 avril 2018

LG G7 ThinQ may have a notch, but new renders show headphone jack too

LG G7 ThinQ renders @evleaks

The official LG G7 ThinQ unveiling is around the corner, but when has that ever stopped leaks?

The latest renders, published by notable leaker Evan Blass, show a few more details about the upcoming flagship phone. A quick glance at the bottom angle reveals a headphone jack, indicating the handset will join Samsung's Galaxy S9, the LG V30s ThinQ, and the upcoming OnePlus 6 in keeping the legacy connection.

Other major features spotted on the phone include dual-cameras, a rear fingerprint scanner, what seems to be a power button on the right-hand side, and an extra button on the left. Previous reports have suggested that the latter will be used as a shortcut for AI features or Google Assistant.

The LG G7 ThinQ is officially confirmed for a May 2 reveal in the U.S., followed by a May 3 event in Seoul, South Korea.

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As per our constantly updated rumor roundup, the G7 ThinQ is expected to pack a Snapdragon 845 processor, 4GB of RAM, and 64GB of storage. The new phone will need to deliver more than the LG V30S ThinQ, which was literally a V30 with more storage, more RAM, and AI-related camera features.

LG is reportedly working on a budget-minded smartphone as well, which could be the Q7. It's unclear whether we'll see this new phone launched alongside the flagship.



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